Top 10 Best scythe cpu in 2021 Comparison Table
- 15% better in performance to noise ratio, FUMA2 has reached itself to next level. Dual heatsinks and fans accelerate and enhance heat dissipation for top-tier performance. 6 x 6mm heatpipes and copper plate base ensure heat from CPU and drop temps. Ideal for mainstream, gaming PC, even overclocking with high TDP processor(9900k, 9700k, 9600k,3700x, 3800x, 3900x, 3950x).
- Asymmetrical design allows unrestricted use of any front RAM slot, and cut-out fin design gives clearance(55mm) of rear RAM slot(LGA2011/2066). Standing only 155mm tall, the cooler fits most PC case on the market.
- Using Kaze Flex 120mm quiet fan(Fluid Dynamic Bearing), FUMA2 use two different thickness(25mm & 15mm) PWM fans rotating in opposite direction. This generates higher static pressure as well as stable airflow thus pushing cooling performance to maximum while keeping silent operation. Addition fan clips is included to add 3rd fan.
- Premium HPMS III is easy-to-install and secure for socket INTEL LGA 775, 1150/1151/1155/1156, 1200, 1366, 2011(V3)Square ILM, 2066 Square ILM & AMD AM2(+), AM3(+), AM4, FM1, FM2(+). This mounting system gives precise contact pressure to CPU and support most popular sockets and motherboards on the market.
- Product dimension: (W)137 x (D)131 x (H)154.5mm, Weight: 1000g. Included thermal compound paste and Y fan cable for installing both fans on one CPU fan header.
- 69mm tall perfectly fits Small Form Factor PC(Mini ITX, HTPC Case), BS3 is 9mm higher than previous version(SCBSK-2100: 59mm). Asymmetric and offset design for excellent compatibility with Mini ITX, Micro ATX motherboards and high-end RAM. Premium model for Intel Core i9, i7, i5, i3 and AMD Ryzen.
- Included Kaze Flex 120 slim PWM fan (Sealed Precision FDB) for long lifespan and quiet operation. ** In case the "CPU FAN ERROR" message is displayed by the UEFI (BIOS), please adjust the UEFI fan speed settings ("CPU Fan Speed Low Limit" - Option).
- Copper base and 5 heatpipe design, the heatsink is equipped with silent fan(15mm thick), and has option using regular 25mm thick fan for greater cooling performance for high TDP processor(9900k, 9700k, 9600k)
- HPMS III spring loaded mounting system is easy to install and secure for INTEL LGA 775, 1150/1151/1155/1156, 1200, 1366, 2011(V3) Square ILM, 2066 Square ILM & AMD AM2(+), AM3(+), AM4, FM1, FM2(+). (Original backplate required for AMD sockets)
- Product dimension: (W)122 x (D)122 x (H)69 mm, Weight: 475g. Incompatible case: RVZ02, MI-6, Ghost S1, Dancase A4-SFX, SG13, S4 Mini, Inwin Chopin, Node 202,
- Quiet 120mm Kaze Flex fan (Fluid Dynamic Bearing) for high airflow and static pressure with silent operation(PWM, 300-1200RPM). Addition fan clip for adding 2nd fan(optional) as push-pull configuration for maximal performance.
- RAM modules with tall heatsink are no problem for the Mugen 5, the asymmetric design allows unrestricted access to the memory banks. Classic size CPU fan stands 154.5mm in height, Mugen5 offers great compatibility with most popular computer case on the markets.
- Secure and easy-to-install spring loaded mounting system compatible with socket INTEL LGA 775 / 1150/1151/1155/1156 / 1200 / 1366 / 2011(V3) Square ILM / 2066 Square ILM & AMD AM4 / AM3(+) / AM2(+) / FM2(+) / FM1
- 6 x 6mm heatpipes and copper plate base ensure greater heat dissipation and superior cooling performance for mainstream, gaming PC, even overclocking with high TDP processor(9900k, 9700k, 9600k,3700x, 3800x, 3900x, 3950x).
- Product dimension: (W)136 x (H)154.5 x (D)110.5mm, Weight: 890g. Thermal compound paste included. Premium model for Intel Core i9, i7, i5, i3 and AMD Ryzen.
- With two Kaze Flex 120 quiet fans at max. speed of only 800 RPM, the push-pull configuration improves cooling performance and keeps low noise level. Anti-vibration rubber on the corners effectively eliminate possible vibrations and allow silent operation.
- Cutout design(55mm clearance) for not overhang memory slots even in LGA2011(V3) / 2066 socket. The fans might be lift up depending on the height of heat spreader module of memory.
- H.P.M.S III mounting systems is easy-to-install and secure for INTEL LGA 775, 115x, 1200, 1366, 2011(V3) Square ILM, 2066 & AMD AM4, AM3(+), AM2(+), FM2(+), FM1
- Massive heatsink(130*X130mm) constructed with 6 heatpipes and copper base to maximize heat dissipation, it is potentially be fanless solution as complete silent PC cooler.
- Product dimension: 138.8x155x180mm(W x H x D), Weight: 1190g (included fan)
- Slim heatsink design, Kotetsu 2 would not overhang RAM and PCIe slots giving great compatibility with graphic cards and tall memory modules. Standing 154mm tall, the cooler easily fits most middle tower computer cases on the market.
- 4 x 6mm heatpipes with copper plate base ensure better heat transfer and dissipation for superior cooling performance. Ideal for mainstream, gaming PC and overlock with high TDP processors.
- Quiet 120mm Kaze Flex fan (Fluid Dynamic Bearing) for high airflow and static pressure with silent operation(PWM, 300-1200RPM).
- H.P.M.S III mounting kit is secure and straight forward, the mounting system gives precise contact pressure to CPU and support most popular sockets and motherboards. Compatible socket: INTEL LGA 775, LGA1150, LGA1151, LGA1155, LGA1156, LGA1200, LGA1366. LGA2011(V3) Square ILM, LGA2066 Square ILM & AMD Ryzen AM4, AM(+), AM2(+), FM2(+), FM
- Product dimension: (W)136 x (D)85 x (H)154mm, Weight: 645g. Included thermal paste and one fan chip only.
- Socket compatibility includes AM2, AM2+, AM3, AM3+, AM4, FM1, FM2, FM2+, LGA 1151 (Socket H4), LGA 2011-v3 (Socket R)
- Fan diameter of 120mm, RPM 800 (PWM)
- Air Flows of 43.03 cfm
- Noise levels up to 14.5dBA
- Overall Dimension: 130mm x 130mm x 154.5mm (WxDxH)
- Offset and fin cut-out design allows high compatibility with RAM with tall heatsink and motherboard components. Compact 92mm cooler size fits most popular PC cases on the market
- E.C.M.S II mounting kit is easy-to-install for socket INTEL LGA 775 / 1150/ 1151/ 1155/1156 /1200/1366 and AMD: AM2(+) / AM3(+) / AM4 / FM1 / FM2(+)
- Kaze Flex 92mm Quiet Fan (FDB) delivers high air flow and long lifespan(120000 hrs) in quiet operation with anti-vibration rubber pad on corners.
- 3 heatpipes and cooper base contribute good heat conductivity and transfer from processor. Enlarged fin stack enhance heat dissipation generating greater performance than other same size coolers on the market.
- Dimension: (W)105 x (D)104mm x (H)135, Weight: 560g
- Socket compatibility includes LGA 1150, LGA 1151,LGA 1155 ,LGA 1156
- Equipped with one fan with dimensions of 5.3in x 6in x 3.3in (WxDxH)
- Rotational Speeds of 1200RPM
- Max Air Flows of 51.17cfm
- Max Noise levels of 4dBA - 24.9dBA
- PC sector Pure Aluminum Particle Hybrid Technology is used to optimize the heat transfer between CPU and heat sink.
- Low thermal resistance, excellent long-term stability and extremely low dry-out characteristics.
- The consistency allows easy to apply and remove, No corrosive properties and no risk of short circuit.
- Thermal Elixer 2 reaches its maximum potential immediately after applying, so no burn-in time required.
- Pro thermal compound ideal for CPU/processor cooler, heatsink, GPU cooler
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Our Best Choice: Scythe Thermal Elixer 2, CPU Thermal Paste, 5g Tube
[ad_1] The new Scythe Thermal Elixer 2 presents superb heat transfer involving the processor and heat sink with out compromising the application. Significant-good quality substances in mixture with the Pure Aluminum Particle Hybrid technology minimize the thermal resistance drastically and make it possible for a practical and controlled application. It has an exceptional extensive-term balance and has no electrically conductivity under standard use. The used thermal grease is all set to be made use of right absent and no “burn off-in” time is essential. Product Range: SCTE-2000, Fat: 5 g / written content, Thermal Resistance: ,013 K-in² / W, Thermal Conductivity: 3.5 W/ (mK), Temperature Range: -20° ~ 120°C, Dielectric Energy: 1.5 KV / mm
Computer system sector Pure Aluminum Particle Hybrid Technologies is employed to optimize the heat transfer between CPU and heat sink.
Lower thermal resistance, superb long-time period security and exceptionally small dry-out features.
The consistency enables effortless to utilize and clear away, No corrosive qualities and no chance of small circuit.
Thermal Elixer 2 reaches its utmost likely quickly immediately after making use of, so no burn-in time needed.
Pro thermal compound great for CPU/processor cooler, heatsink, GPU cooler